Optimization in laser grooving process of IC package for thick metal layer
碩士 === 國立彰化師範大學 === 電子工程學系 === 104 === In the field of semiconductor packaging, with the progress of time, a variety of 3C electronic product development are toward light, thin, short, small multi-functional design. However, the most front-end process of designing and manufacturing the wafer is to b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37804002285759337526 |