Wire bonding process in IC packaging - the analysis of reliability for the contents of silver alloy wire
碩士 === 國立彰化師範大學 === 電子工程學系 === 104 === At the present stage, the wire bonding process is using copper alloy wire due to its has high thermal, electrical conductivity and lower cost than gold alloy wire. It is widely used to instead of the traditional use of gold alloy wire. However, the copper alloy...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87s3mf |