開發IC封裝製程電漿清洗基板技術
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 104 === Ｃurrently, the products of the IC package in the W/B(Wire Bond) station have to run the Plasma Cleaning process in order to improve the wire bond force capability, so I have to define the different parameters of the Plasma. However,because of the size an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15250046762272850113 |