開發IC封裝製程電漿清洗基板技術

• Main Authors: Shang-Hung Liu, 劉尚宏
• Other Authors: frank tzeng
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/15250046762272850113

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 104 === Ｃurrently, the products of the IC package in the W/B(Wire Bond) station have to run the Plasma Cleaning process in order to improve the wire bond force capability, so I have to define the different parameters of the Plasma. However,because of the size and the thickness of Die in the products become smaller and smaller, the products in Plasma cleaning process can not move smoothly in the unloader area. Another serious problem is that the product has some warpage and acking problem because the electrode field will be effected and may be burned,so I try my best to prevent the products to be burned. Because of the large application in IC industry , I focus on the special design of the plasma’s function and the experiments.I use the Taguchi method to design a series of the related parameters of the Plasma Cleaning. I setup the parameters by the application of Taguchi orthogonal array L18((21x37) . The water angle has to be measured and to be confirmed in matching the cleaning range, and further, I also study the different cathode which maybe generate the different impact of the Plasma.