Effects of die thickness and location of Cu pillar bump on structural stresses in a package under the conditions of thermal compression bonding process and temperature cycling.
碩士 === 國立屏東科技大學 === 材料工程研究所 === 104 === This study investigates the effects of die thickness and location of Cu pillar bump on structural stresses in a package under the conditions of thermal compression bonding process and temperature cycling using ANSYS. This package was fabricated by thermally co...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/87874109334116133316 |