Reliability of Coreless substrate under thermal loading
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 104 === The thesis aims to enhance the reliability of the flip-chip ball grid array (FCBGA) package and coreless substrate by changing the material properties of dielectric material, thickness and copper coverage. The probability of failure of the package owing to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3a4zwa |