Research and Development of Wafer Dicing Equipment with Measuring 3D Dicing Forces
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 104 === Wafer dicing technology is one of the steps in wafer packaging. Currently sold wafer dicing machines have no measurement system of dicing forces, so that they are unable to understand the physical phenomena arising from the wafer dicing process. The present...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01300814045736699773 |