Material Characterization of Temperature Resistant Interconnection for High-Power Module
博士 === 國立清華大學 === 動力機械工程學系 === 104 === Power module with high power density and high heat dissipation structure has been developed because of increasing requirement for high-power electric products. Nowadays, most power modules use metal wire as interconnection, which results in the limited heat dis...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12764294643120579404 |