Design and Reliability Assessment of Novel 3D IC Packaging
博士 === 國立清華大學 === 動力機械工程學系 === 104 === Recently, physical limitations restrict the development of microelectronic industry following Moore’s law. To achieve high performance, small form factor and lightweight application, the electronic packaging has developed following more than Moore’s law which i...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79310908180298135598 |