Thermal-aware Dynamic Page Allocation Policy Considering Future Access Patterns for Hybrid Memory Cube (HMC)
碩士 === 國立清華大學 === 資訊工程學系 === 104 === Three-dimensional (3-D) memory stacking like Hybrid Memory Cube (HMC) can resolve memory bandwidth challenges for multi-core system where stacked multiple DRAM dies are connected by Through Silicon Vias (TSVs). However, high power density due to the high in- tegr...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42112995105675746617 |