Architectural Evaluations on TSV Redundancy for Reliability Enhancement
碩士 === 國立清華大學 === 資訊工程學系 === 104 === Three-dimensional Integrated Circuits (3D-ICs) is a next-generation technology that could be a solution to overcome scaling problem. It stacks dies with Through-Silicon Vias (TSVs) so that signals can transmit through dies vertically. TSV may fail when a chip is...
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24666372683301496822 |