Online Slack-Time Binning for IO-Registered Die-to-Die Interconnects
碩士 === 國立清華大學 === 電機工程學系 === 104 === In a today's multi-die integrated IC, the die-to-die interconnects are often complicated and susceptible to various kinds of manufacturing defects and stress-induced performance degradation in the field. This phenomenon has prompted a need to perform online...
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07045424390193090656 |