Study of Copper / Ruthenium Chemical Mechanical Polishing in alkaline hydrogen peroxide system with ammonium persulfate and nanoscale silica
碩士 === 國立臺灣大學 === 化學工程學研究所 === 104 === The study can be separated to three parts. The first part focus on probing the electrochemical factors when copper and ruthenium film reacting in different concentration of hydrogen peroxide slurries, adjusting to pH9 by sodium hydroxide. For the second part, w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73273588571831566523 |