Modeling and Simulation on the Condenser Microphone with Stepped Backplate

碩士 === 國立臺灣大學 === 應用力學研究所 === 104 === In recent years, the mobile devices are popular such as notebooks and smart phones. MEMS microphones with small size and high performance are ideal for consumer electronics products. MEMS microphone’s structure including the diaphragm, the acoustic holes of back...

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Bibliographic Details
Main Authors: Fu-Lin Jian, 簡福臨
Other Authors: Pei-Zen Chang
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/5rcuf8