A Novel Solvent Bonding Method for Thermoplastic Microfluidic Chips
碩士 === 國立臺灣科技大學 === 機械工程系 === 104 === This thesis presents a novel solvent bonding method aimed at improving the strength of bonds formed between PMMA/PMMA, PMMA/PC, and PMMA/PET thermoplastic substrates. A spin-coating procedure was applied as an alternative to the dropping method for the distribut...
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| Format: | Others |
| Language: | en_US |
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2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54330628712528426552 |