Research of Compliant Pellets Assisted Chemical Mechanical Planarization Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 104 === This research aims to use compliant pellets assisted chemical mechanical polishing (CPACMP) in a wafer planarization process without pad dressing. In CPACMP method, a soft polishing pad with asperities has been replaced by combinational using a polycarbonate (PC...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8x554h |