The Study of Interfacial Reactions and Mechanical Properties between Sn-9.0Zn、Sn-3.0Ag-0.5Cu and Ag Substrate with Reflowing Times
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 104 === In this study, Sn-9wt%Zn、Sn-3.0wt%Ag-0.5wt%Cu solders and the Ag metal were prepared to form the reaction couples. During different reflowing times, we investigated interfacial reaction and mechanical properties of the reaction couples. The results showed tha...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2016
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Online Access: | http://ndltd.ncl.edu.tw/handle/3ugkgg |