The Study on Impedance Test Coupon Improvement of Ball Grid Array Substrate
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === The objective of this thesis is to develop a method of impedance test coupon de-sign for BGA substrate. Characteristic impedance of transmission line which connects devices on a circuit is important for high speed substrate design and is essenti...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2016
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Online Access: | http://ndltd.ncl.edu.tw/handle/16756037433356721696 |