The Study on Impedance Test Coupon Improvement of Ball Grid Array Substrate

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === The objective of this thesis is to develop a method of impedance test coupon de-sign for BGA substrate. Characteristic impedance of transmission line which connects devices on a circuit is important for high speed substrate design and is essenti...

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Bibliographic Details
Main Authors: Hui-Yi Hsiao, 蕭惠怡
Other Authors: Ming-Chang Shi
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/16756037433356721696