Non-destructive Fault Localization Failure Analysis for Advanced Electronic Packages
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === As advanced IC package substrate become more complex with multilayer structure, thus using traditional analysis of non-destructive testing methods such as x-ray, ultrasound scanning and detection technology are not applicable. This thesis will e...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18980905685575001397 |