The Study for Parameters in Pulse Laser Grooving Profile for Die Sawing
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === While semiconductor packages become thinner, lighter, and smaller, the wafer used for dies sawing become thinner and more complex of structure. Recently, laser processing become an effective solution in advance semiconductor package technology,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47926024616536219334 |