Study Underfill Material to Improve the Effect of Function Fail for Flip Chip Packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === The topic for this paper is IC electrical failure analysis. The underfill void may be the key factor on IC electrical failure, it may caused by different primer material parameter with difference of underfill flow.Simulate underfill's liqui...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37133258180702478889 |