Preparation of Ag andAg(Cu) Thin Film by Electrochemical Atomic Layer Deposition
碩士 === 國立虎尾科技大學 === 材料科學與工程系材料科學與綠色能源工程碩士班 === 104 === Due to the increase in the edvice density recentry, lead to increase in RC delay. when the device size is down. Silver has shown a reduced electrical resistance but suffer from stability and adhesion. In this report, we used Electrochemical Ato...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/f64s7d |