Study of the Cu-Al Bimetal Interfacial Bonding and Its Effect on Electrical Conductivity
碩士 === 國立臺北科技大學 === 材料科學與工程研究所 === 104 === The current study forms and observe the Cu-Al bimetallic interface to simulate the connections between aluminum end rings and Cu motor rotor. Heat treatments were applied to observe the evolution of Cu-Al interface structure while in service. The electrical...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/f8z5c2 |