Filling the through silicon via of capacitive micromachined ultrasonic transducer by supercritical fluid plating process
碩士 === 國立臺北科技大學 === 機電整合研究所 === 104 === The purpose of this work is to study the application of supercritical CO2 electroplating, post supercritical CO2 electroplating and traditional electroplating processes to fabricate Cu metal thin films, and discuss the effects of adjusting the electroplating p...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/pmkk32 |