Self-annealing Mechanism of Electroplated Cu in the Blind-hole Structure of High-density-interconnection Printed Circuit Boards (HDI-PCBs)
碩士 === 元智大學 === 化學工程與材料科學學系 === 104 === Blind-hole (BH) metallization by electrolytic Cu fillings technology has become a critical process for fabricating high density interconnection (HDI) circuit boards in electronic industry because it it provides high thermal and electrical conductivity. Althoug...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46593551772826064723 |