Crystallographic Evolution of Cu-Sn Intermetallics and Their Growth Behaviors in 3D IC Joints
碩士 === 元智大學 === 化學工程與材料科學學系 === 104 === The present study has attempted to ex-situ observe the Cu-Sn intermetallic compounds (IMCs) microstructure and the growth behaviors of the IMCs formed, Cu6Sn5(~16 μm)/Cu micro-joints during isothermal annealing at 180 °C was examined using a field-emission sca...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34685401729374027271 |