The Package IC Warpage Model
碩士 === 元智大學 === 機械工程學系 === 104 === The present work develops the warpage model of package IC during temperature change. The long-term goal is to improve the warpage of package IC through material and structure selection. The experiment focuses on characterization of warpage of package IC and its rel...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39861658874496634601 |