The Package IC Warpage Model

碩士 === 元智大學 === 機械工程學系 === 104 === The present work develops the warpage model of package IC during temperature change. The long-term goal is to improve the warpage of package IC through material and structure selection. The experiment focuses on characterization of warpage of package IC and its rel...

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Bibliographic Details
Main Authors:	Hung-Chih Kuo, 郭弘智
Other Authors:	N. Yu
Format:	Others
Language:	zh-TW
Published:	2016
Online Access:	http://ndltd.ncl.edu.tw/handle/39861658874496634601

id	ndltd-TW-104YZU05489027
record_format	oai_dc
spelling	ndltd-TW-104YZU054890272017-08-20T04:07:26Z http://ndltd.ncl.edu.tw/handle/39861658874496634601 The Package IC Warpage Model 電子封裝翹曲模型 Hung-Chih Kuo 郭弘智碩士元智大學機械工程學系 104 The present work develops the warpage model of package IC during temperature change. The long-term goal is to improve the warpage of package IC through material and structure selection. The experiment focuses on characterization of warpage of package IC and its relationship between material properties, such as coefficient of thermal expansion (CTE), modulus of elasticity, glass transition temperature (Tg), followed by varying material structure (size/thickness) to meet specifications. Finally, the warpage of compound/substrate is estimated by the classical laminated theory, and is verified with experimental data. N. Yu 余念一 2016 學位論文 ; thesis 45 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 元智大學 === 機械工程學系 === 104 === The present work develops the warpage model of package IC during temperature change. The long-term goal is to improve the warpage of package IC through material and structure selection. The experiment focuses on characterization of warpage of package IC and its relationship between material properties, such as coefficient of thermal expansion (CTE), modulus of elasticity, glass transition temperature (Tg), followed by varying material structure (size/thickness) to meet specifications. Finally, the warpage of compound/substrate is estimated by the classical laminated theory, and is verified with experimental data.
author2	N. Yu
author_facet	N. Yu Hung-Chih Kuo 郭弘智
author	Hung-Chih Kuo 郭弘智
spellingShingle	Hung-Chih Kuo 郭弘智 The Package IC Warpage Model
author_sort	Hung-Chih Kuo
title	The Package IC Warpage Model
title_short	The Package IC Warpage Model
title_full	The Package IC Warpage Model
title_fullStr	The Package IC Warpage Model
title_full_unstemmed	The Package IC Warpage Model
title_sort	package ic warpage model
publishDate	2016
url	http://ndltd.ncl.edu.tw/handle/39861658874496634601
work_keys_str_mv	AT hungchihkuo thepackageicwarpagemodel AT guōhóngzhì thepackageicwarpagemodel AT hungchihkuo diànzifēngzhuāngqiàoqūmóxíng AT guōhóngzhì diànzifēngzhuāngqiàoqūmóxíng AT hungchihkuo packageicwarpagemodel AT guōhóngzhì packageicwarpagemodel
_version_	1718517796822843392

The Package IC Warpage Model

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