High Frequency Analysis on 10μm Through-Silicon Via(TSV) Structure
碩士 === 國防大學理工學院 === 航空太空工程碩士班 === 105 === As the flourishing development of the IC industry in recent years, the electronic packaging technology trend goes toward higher density, smaller size and lighter weight. Consequently, The TSV (Through Silicon Via) technology becomes a key to 3D integration....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6bx4bj |