Fabrication of Circuit on Substrate by Laser-assisted Thermal-crosslinking Ink.
碩士 === 國防大學理工學院 === 化學工程碩士班 === 105 === The aim of this study is to fabricate copper circuit on the PC/ABS substrates by Laser Direct Writing. By heating the surface of PC/ABS, the thermal crosslinking catalyst ink is reduced and cured, so that only the laser irradiated area can be metalized in the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/z3kvud |