| Summary: | 碩士 === 國防大學理工學院 === 化學工程碩士班 === 105 === The aim of this study is to fabricate copper circuit on the PC/ABS substrates by Laser Direct Writing. By heating the surface of PC/ABS, the thermal crosslinking catalyst ink is reduced and cured, so that only the laser irradiated area can be metalized in the subsequent electroless plating.
At atmospheric pressure the palladium(II) acetate decomposed to Pd between 200°C and 300°C.The Pd metal provide a seed layer for the following electroless plating.4-Vinylpyridine(4VP) monomer Contained in ink has pyridine group which is able to form chelate with Pd2+ as a protection from Pd2+ being reduced by hydroxyl in ethanol. Tert-butyl peroxybenzoate(TBPB) is a initiator which generate free radical in heat process to execute condensation reaction. Trimethylolpropanetriacrylate(TMPTA) played a role of cross-linking agent in the catalyst ink. Cured polymer enhanced adhesion between catalyst layer and copper metal layer.
In order to optimize laser parameter, orthogonal experiment was executed included power, frequency, pulse width, and scan speed. Every each parameter associated with the thermal accumulation on the surface of PC/ABS. Appropriate thermal accumulation was necessary to activate catalyst ink for metallization. Adhesion was improved through increasing the concentration of TAMPTA. Metal pattern fabricated by LDW passed tape test with 3M 600 tape. In addition, the resistance of the copper layer is 0.015 Ω/□. Meanwhile, the result exhibits higher thickness of copper layer at 4.5 μm, it was fabricated via 40 min electroless deposition. This study demonstrates a way to fabricate metal pattern by LDW instead of LDS invented by LPKF.
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