Inspection of X-ray BGA Solder Balls Using Image Processing

碩士 === 長庚大學 === 電機工程學系 === 105

Bibliographic Details
Main Authors: Chia Yu Tseng, 曾家俞
Other Authors: J. D. Lee
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/64d3mu