interfacial Reactions at the Sn/Cu-Mn couples
碩士 === 中原大學 === 化學工程研究所 === 105 === Flip Chip is one of the important technology in Electronic Packaging, and the copper''s UBM(Under bump metallurgy) is the most important part of Flip Chip, It is easy to cause Kirkendall to be generated during UBM and Sn causes a rapid reaction w...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/28145444641915733035 |