| Summary: | 碩士 === 中原大學 === 化學工程研究所 === 105 === Flip Chip is one of the important technology in Electronic Packaging, and the copper''s UBM(Under bump metallurgy) is the most important part of Flip Chip, It is easy to cause Kirkendall to be generated during UBM and Sn causes a rapid reaction which has a negative effect for solder joint reliability. However, adding third element can suppress Kirkendall. The purpose of this study was to investigate the addition of Mn affect Sn / Cu system.
The tiny grain of (Cu,Mn)6Sn5 is found near solder and, the large grain of Cu6Sn5 and the tiny grain of (Cu,Mn)6Sn5 are found near substrate when content of Mn was 10wt% in the liquid / solid interface reaction of Sn / Cu- (10 ~ 40) wt% Mn at 250oC, and the reaction mechanism is discussed. At 400oC in the liquid / solid interface reaction, it is found that in the ternary phase, using its atomic ratio to compare Sn & Cu & Mn diffusion rate, Cu is the slowest.
The phase equilibria of Ω phase is the steady phase of Thermodynamics, and construct the 2theta position of XRD diffraction peak of the Ω phase.
Other portions of the phase equilibria had 3 three-phase, eight two-phase and eight single-phase.Finally, maximum solubility of Mn in Cu3Sn and Cu6Sn5 were 6.5at%, 4.1 at%, respectively. Maximum solubility of Cu in MnSn2 was 4.4 at%.
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