Study on the Laser Sensitive Activate Powder for Replacing LDS Proprietary Materials
碩士 === 中原大學 === 機械工程研究所 === 105 === Miniaturization of 3C communication and electronic product is an important trend in technology. A Technology is using 3D-MID (Three Dimensional Molded Interconnect Device) to combine electrical and mechanical performance of material and it could apply flexibly to...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05649788777903822125 |