Study on thermal stress and mechanical stress characteristics of LED assembly package
碩士 === 中原大學 === 機械工程研究所 === 105 === Solder, a key material in failure of electronic packaging, was important in bonding properties and composition of ingredient. The growth and weldability of intermetallic compound (IMC) were crux in electronic packaging when it was stick together. Au-20Sn, a kind o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23e43w |