Research for the Fixture Type Effect of Rack Electroplating Machineon Gold Bump Uniformity
碩士 === 中原大學 === 機械工程研究所 === 105 === The costs of assembly bonding house and supply chain are ascending with the higher and higher gold price, especially in driver IC assembly whose process utilizes the gold bumps to be the connect components between ICs and carrier substrates. Consequently, how to r...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74275542502352409580 |