Compensation for impedance mismatch of plated through-hole vias with via stubs in multilayer PCBs by using high-impedance lines
碩士 === 中原大學 === 通訊工程碩士學位學程 === 105 === This paper is studied in multilayer printed circuit board (PCB), the transmission signal line is transmitted by signal via, while the unused connecting signal via will form a stub, it will influence Frequency-Domain Return Loss |S11|, Insertion Loss |S21|and Ti...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vj85w4 |