Properties of Self-Assembled-Monolayer Encapsulated Electroless Copper Nanowires Fabricated by Using an All-Wet Process
碩士 === 逢甲大學 === 材料科學與工程學系 === 105 === Currently, sputter deposited TaN/Ta and electrochemically plated Cu metallization layers are the key interconnection thin-film materials for integrated circuits. However, in the face of future technology nodes scaling continues to decline, this wet and dry combi...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64909285469077125456 |