Study on Inspection of Printed Circuit Board Defects by Micro-etching Method

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 105 === The purpose of this study is utilizing the micro-etching method to examine the defects of via in the Printed Circuit Board. The preparation of micro-etching solution is based on ammonia, and it is discussed whether different micro-etching times a...

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Bibliographic Details
Main Authors: CHOU,YA-TING, 周雅婷
Other Authors: YANG,WEIN-DUO
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/7thvas