Study on Inspection of Printed Circuit Board Defects by Micro-etching Method
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 105 === The purpose of this study is utilizing the micro-etching method to examine the defects of via in the Printed Circuit Board. The preparation of micro-etching solution is based on ammonia, and it is discussed whether different micro-etching times a...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7thvas |
| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 105 === The purpose of this study is utilizing the micro-etching method to examine the defects of via in the Printed Circuit Board.
The preparation of micro-etching solution is based on ammonia, and it is discussed whether different micro-etching times and the addition of hydrogen peroxide can contribute to the appearance of via in the printed circuit board.
The study showed that 10 % ammonia was added with 0.06 g of hydrogen peroxide and etched for 5 seconds exhibited to the best textures including copper grain boundaries, plating lines and micro wedge lines after the micro-etching of printed circuit board. By using the best micro-etching solution, the defects in the via of printed circuit board were examined clearly.
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