Interfacial Reaction in Electroplated Cu/Ni/Sn System
碩士 === 國立中興大學 === 化學工程學系所 === 105 === In this study, the electroplating copper substrate and tin, electroplating copper substrate electroplating nickel and tin two kinds of reaction comparison, and in the copper electroplating solution by adding the additive SPS for further comparison. The experimen...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87495446472521833248 |