Interfacial Reaction in Electroplated Cu/Ni/Sn System

• Main Authors: Shang-Wei Chi, 紀尚緯
• Other Authors: Chih-Ming Chen
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/87495446472521833248

碩士 === 國立中興大學 === 化學工程學系所 === 105 === In this study, the electroplating copper substrate and tin, electroplating copper substrate electroplating nickel and tin two kinds of reaction comparison, and in the copper electroplating solution by adding the additive SPS for further comparison. The experimental results show that Cu / Sn mainly produces IMC as Cu6Sn5 in the reflow soldering reaction, and Ni(Ni, Cu)3Sn4 is formed after electroplating the Ni layer. No holes are present in the interface. The presence of SPS does not affect the results. In the heat treatment at 150°C, Cu / Sn forms Cu3Sn in addition to Cu6Sn5, and many pores are formed in the interface of IMC. The reaction is accelerated at 200 ° C and becomes a layered structure with more pores. Using additive SPS are produced no holes at 150 ° C or 200 ° C after the copper plating solution. Copper substrate after electroplating nickel layer in two kinds of heat treatment are no holes and layered structure, the use of additives SPS in copper plating solution does not affect the results. If extend the heat treatment time, nickel layer reaction will not appear holes immediately in the interface. The experimental results show that electroplating copper substrate electroplating nickel can effectively prevent the hole in IMC interface and can be used with the additive SPS without affecting the results, and elongation the electroplating nickel reaction time, will not be observed holes are produced in the interface.