Effect of thermal aging temperature on the interfacial reactions between electroplated Cu and Sn
碩士 === 國立中興大學 === 化學工程學系所 === 105 === Nowadays, development of microelectronic products follows the trend of miniaturization with the progress of technology. Therefore, the size of the solder joints shrinks and the reliability issue can not be avoided in semiconductor industry. One main reliability...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04732656932672092000 |