Capacitive Coupling Wireless Testing Application on Probe Card
碩士 === 國立中興大學 === 資訊科學與工程學系 === 105 === Abstract According to Moore’s Law, the manufacture of semi-conduction is going to face the bottleneck. The Fabrications as TSMC, UMC and Memory Fabrications as Micron, NAYA, are pursuing for low cost and high output now. In wafer manufacture process, testing...
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29122285606355542016 |