Chip Scale Package LED Beam Pattern Measurement and Simulation

碩士 === 國立中興大學 === 精密工程學系所 === 105 === LED nowadays is usually packed by single-sided small white case. This paper is to discuss and compare the CSP LED which utilizes five sides to light with the small white case package. The volume of CSP LED is smaller and has four additional lateral sides to ligh...

Full description

Bibliographic Details
Main Authors: Yuan-Lung Chou, 周遠龍
Other Authors: Han Pin
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/12274385268271505584