Investigation of Development of Combined Impregnated Diamond Lapping Plate
碩士 === 國立勤益科技大學 === 機械工程系 === 105 === With the advancement of technology advances, the volume of electronic power components has been toward high power, high temperature, small size of the development trend in recent years, the development of Si power devices encounter a problem, its physical limits...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6wxred |