Finite Element Analysis of the Influence of Lead Frame Geometry on Stress
碩士 === 國立成功大學 === 工程科學系 === 105 === Due differences in coefficients of thermal expansion between different materials, delamination and warpage may occur in electronic packages because of thermal stresses. In this study we used finite element analysis to numerically analyze the thermal stress created...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7vp7sj |