Integration of FinFETs with Advanced Fabrication Techniques: Neutral Beam Etching, Microwave Annealing and Seedless Metallization
博士 === 國立成功大學 === 電機工程學系 === 105 === When the feature size of logic devices is scaling down toward 10 nm and beyond, current manufacturing techniques are facing a variety of challenges due to higher processing requirement. Improvement on current techniques or development of novel technology thus...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ynfpu4 |