Die-shift failure analysis and alleviation strategy for wafer reconstitution process of advanced packaging technology

碩士 === 國立成功大學 === 機械工程學系 === 105

Bibliographic Details
Main Authors: Yu-ChengLiu, 柳昱丞
Other Authors: Tian-Shiang Yang
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/d3mck7